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rev description date prep appd k co - 14428 4/30/09 df/ lt lt date vectron international mount holly springs, pa 17065 prepared by stan carpenter 10/26/00 oscillator specification, hybrid clock quality swp 11/1/00 hi-rel standard engineering s. carpenter 10/30/00 code ident no size dwg. no. rev 00136 a os-68338 k unspecified tolerances: n/a sheet 1 0f 20
size code ident no. unspecified tolerances dwg no. rev. sheet a 00136 n/a os-68338 k 2 1. scope 1.1 general. this specification defines the design, as sembly and functional evaluation of high reliability, hybrid clock oscillators produced by v ectron international. devices delivered to this specification represent the standardized parts , materials and processes (pmp) program developed, implemented and certified for advanced a pplications and extended environments. 1.2 applications overview. the designs represented by these products were primarily developed for the mil-aerospace community. the lesser design pedigrees and screening options imbedded within os-68338 bridge the gap between spa ce and cots hardware by providing custom hardware with measures of mechanical, assemb ly and reliability assurance needed for military or ruggedized cots environments. 2. applicable documents 2.1 specifications and standards. the following specif ications and standards form a part of this document to the extent specified herein. the issue currently in effect on the date of quotation will be the product baseline, unless otherwise spec ified. in the event of conflict between the texts of any references cited herein, the text of t his document shall take precedence. military mil-prf-55310 oscillators, crystal controlled, gene ral specification for mil-prf-38534 hybrid microcircuits, general specifi cation for standards mil-std-202 test method standard, electronic and el ectrical component parts mil-std-883 test methods and procedures for microel ectronics mil-std-1686 electrostatic discharge control progra m for protection of electrical and electronic parts, assemblies and equipment other ht-67849 test specification, os-68338 hybrids, hi-r el standard qsp-90100 quality systems manual, vectron internati onal vl-65339 identification common documents, materials and processes, hi-rel xo 3. general requirements 3.1 classification. all devices delivered to this specification are of hybrid technology conforming to type 1, class 2 of mil-prf-55310. primarily dev eloped as a class s equivalent specification, options are imbedded within it to al so produce class b, engineering model and ruggedized cots devices. devices carry a class 2 e sds classification.
size code ident no. unspecified tolerances dwg no. rev. sheet a 00136 n/a os-68338 k 3 3.2 item identification. external packaging choice s are of metal flatpacks, dip?s and ceramic j- lead 9x14mm and lcc?s with either ttl or acmos logi c output. unique model number series? are utilized to identify device package con figurations and output logic as listed in table 1. 3.3 absolute maximum ratings. a. supply voltage range (v cc ): -0.5vdc to +7.0vdc b. storage temperature range (t stg ): -65c to +125c c. junction temperature (t j ): +175c d. lead temperature (soldering, 10 seconds): +300c e. output source/sink current 70 ma 3.4 design, parts, materials and processes, assembl y, inspection and test. 3.4.1 design. the ruggedized designs implemented f or these devices are proven in military and space applications under extreme environments. des igns utilize 4-point crystal mounting in compliment with established reliability (mil-er) co mponentry. when specified, radiation hardening up to 100krad(si) (rha level r) can be in cluded without altering the device?s internal topography. 3.4.1.1 design and configuration stability. barrin g changes to improve performance by reselecting passive chip component values to offset component t olerances, there will not be fundamental changes to the design or assembly or parts, materia ls and processes after first product delivery of that item without written approval from the proc uring activity. 3.4.1.2 environmental integrity. designs have pass ed the environmental qualification levels of mil- prf-55310. these designs have also passed extended dynamic levels of at least: sine vibration: mil-std-202, method 204, condition g (30g pk.) random vibration: mil-std-202, method 214, conditio n ii-j (43.92g rms) mechanical shock: mil-std-202, method 213, conditio n f (1500g, 0.5ms) 3.4.2 prohibited parts, materials and processes. t he items listed are prohibited for use in high reliability devices produced to this specification. a. gold metallization of package elements without a barrier metal. b. zinc chromate as a finish. c. cadmium, zinc, or pure tin external or internal to the device. d. plastic encapsulated semiconductor devices. e. ultrasonically cleaned electronic parts. f. heterojunction bipolar transistor (hbt) technolo gy. g. ?getter? materials 3.4.3 assembly. manufacturing utilizes standardize d procedures, processes and verification methods to produce mil-prf-55310 class s / mil-prf- 38534 class k equivalent devices. mil-prf-38534 group b option 1 in-line inspection i s included on radiation hardened part numbers to further verify lot pedigree. traceabili ty of all components and production lots are
size code ident no. unspecified tolerances dwg no. rev. sheet a 00136 n/a os-68338 k 4 in accordance with mil-prf-38534, as a minimum. ta bulated records are provided as a part of the deliverable data package. devices are handl ed in accordance with mil-std-1686 for class 1 devices. 3.4.4 inspection. the inspection requirements of m il-prf-55310 apply to all devices delivered to this document. inspection conditions and standards are documented in accordance with the quality assurance, iso-9001 derived, system of qsp- 90100. 3.4.5 test. the screening test matrix of table 5 i s tailored for selectable-combination testing to eliminate costs associated with the development/mai ntenance of device-specific documentation packages while maintaining performance integrity. 3.4.6 marking. device marking shall be in accordan ce with the requirements of mil-prf-55310. 3.4.7 ruggedized cots design implementation. desig n pedigree ?d? devices (see ? 5.2) use the same robust designs found in the other device pedig rees. they do not include the provisions of traceability or the class-qualified componentry not ed in paragraphs 3.4.3 and 4.1. 4. detail requirements 4.1 components 4.1.1 crystals. cultured quartz crystal resonators are used to provide the selected frequency for the devices. the optional use of premium q swept quart z can, because of its processing to remove impurities, be specified for better frequency aging characteristics. in accordance with mil- prf-55310, the manufacturer has a documented crysta l element evaluation program. 4.1.2 passive components. established reliability (er) failure level r minimum passive components are procured from qpl suppliers. lot eva luations are in accordance with mil- prf-55310 or enhanced element evaluation as specifi ed in table 7. 4.1.3 class s microcircuits. microcircuits are pro cured from wafer lots that have passed mil-prf- 55310 lot acceptance tests for class s devices. th e prescribed die carries a class 2 esds classification in accordance with mil-prf-38535. w hen optionally specified, further testing in accordance with mil-prf-55310 and mil-prf-38534 is performed for radiation hardness assurance and for enhanced element evaluation as sp ecified in table 6. those microcircuits, identified by a unique part number, are certified f or 100krad(si) total ionizing dose (tid), rha level r (2x minimum margin). nsc, as the origi nal 54act designer, rates the seu let at >40 mev and sel at >120mev for the fact? fam ily (an-932). vectron has conducted additional see testing in 2008 to verify this performance since our lot wafer testing does not include these parameters and determination s.
size code ident no. unspecified tolerances dwg no. rev. sheet a 00136 n/a os-68338 k 5 4.1.3.1 class b microcircuits. when specified, mic rocircuits assembled into os-68338 design pedigree letters ?b? and ?c? devices (? 5.2a) are p rocured from wafer lots that have passed mil-prf-55310 element evaluations for class b devic es. 4.1.4 packages. packages are procured that meet th e construction, lead materials and finishes as specified in mil-prf-55310. package lots are upscr eened in accordance with the requirements of mil-prf-38534 as applicable. 4.1.5 traceability. class s active device lots are homogenous and traceable to the manufacturer?s individual wafer. swept quartz crystals are traceab le to the quartz bar and the processing details of the autoclave lot, as applicable. all o ther elements and materials are traceable to their manufacturer and incoming inspection lots. 4.1.6 enhanced element evaluation. when design pedi gree option ?e? is specified, active and passive devices with enhanced element evaluation as listed in table 6 and 7 shall be implemented for the highest reliability preference. 4.2 mechanical. 4.2.1 package outline. table 1 links each hi-rel standard model number of this specification to a corresponding package style. mechanical outline in formation of each package style is found in the referenced figure. 4.2.2 thermal characteristics. the worst case ther mal characteristics of each package style are found in table 4. 4.3 electrical. 4.3.1 input power. devices are designed for standa rd 5.0 volt dc operation, 10%. optional 3.3 vdc (10%) input performance for acmos output condi tions. current is measured, no load, at maximum rated operating voltage. 4.3.2 temperature range. operating range is -55c t o +125c. 4.3.3 frequency tolerance. initial accuracy at +23 c is 15 ppm maximum. frequency- temperature stability is 50 ppm maximum from +23c reference. frequency-voltage tolerance is 4 ppm maximum. 4.3.4 frequency aging. aging limits, and when test ed in accordance with mil-prf-55310 group b inspection, shall not exceed 1 ppm the first 30 da ys, 5 ppm year 1 and 2 ppm per year thereafter. when screening option f is selected, ag ing is performed on 100% of the lot and vectron does not apply the pda as specified in mil- prf-55310. data will be presented for each individual unit to show compliance to the agin g limit.
size code ident no. unspecified tolerances dwg no. rev. sheet a 00136 n/a os-68338 k 6 4.3.4.1 frequency aging duration option. by custom er request, the aging test may be terminated after 15 days if the measured aging rate is less th an half of the specified aging rate. this is a common method of expediting 30-day aging without in curring risk to the hardware and used quite successfully for numerous customers. it is b ased on the ?least squares fit? determinations of mil-prf-55310 paragraph 4.8.35. the ?half the t ime/half the spec? limit is generally conservative as roughly 2/3 of a unit?s aging devia tion occurs within that period of time. vectron?s automated aging systems take about 6 data points per day, so a lot of data is available to do very accurate projections, much mor e data than what is required by mil-prf- 55310. the delivered data would include the aging plots projected to 30 days. if the units would not perform within that limit then they would continue to full 30 day term. please advise by purchase order text if this may be an acc eptable option to exercise as it assists in production test planning. 4.3.5 operating characteristics. symmetrical squar e wave limits are dependent on the device frequency and are in accordance with tables 2 and 2 a. waveform measurement points and logic limits are in accordance with mil-prf-55310. start-up time is 10.0 msec. maximum. 4.3.6 output load. standard ttl (6 or 10) and acmos (10k , 15pf) test loads are in accordance with mil-prf-55310. 5. quality assurance provisions and verification 5.1 verification and test. device lots shall be tested prior to delivery in accordance with the applicable screening option letter as stated by the 15 th character of the part number. table 5 tests are conducted in the order shown and annotate d on the appropriate process travelers and data sheets of the governing test procedure. for d evices that require screening options that include mil-prf-55310 group a testing, the post-bur n-in electrical test and the group a electrical test are combined into one operation. 5.1.1 screening options. the screening options, by lette r, are summarized as: a modified mil-prf-38534 class k b modified mil-prf-55310 class b screening & group a quality conformance inspection (qci) c modified mil-prf-55310 class s screening & group a qci d modified mil-prf-38534 class k with burn-in delta aging e modified mil-prf-55310 class b screening, groups a & b qci f modified mil-prf-55310 class s screening, groups a & b qci g modified mil-prf-55310 class b screening & post burn-in nominal electricals x engineering model (em) 5.2 optional design, test and data parameters. the following is a list of design, assembly, inspection and test options that can be selected or added by purchase order request.
size code ident no. unspecified tolerances dwg no. rev. sheet a 00136 n/a os-68338 k 7 a. design pedigree (choose one as the 5 th character in the part number): (e) enhanced element evaluation, 100krad class s die , premium q swept quartz (r) hi-rel design w/ 100krad class s die, premium q swe pt quartz (v) hi-rel design w/ 100krad class s die, cultured quar tz (x) hi-rel design w/ cultured quartz, class s die (b) hi-rel design w/ swept quartz, class b die (c) hi-rel design w/ cultured quartz, class b die (d) hi-rel design w/ cultured quartz and commercial gra de components b. input voltage, (a) for 5.0v, (b) for 3.3v as the 14 th character c. frequency-temperature slew test d. radiographic inspection e. group c inspection: mil-prf-55310 (requires 8 pc . sample) f. group c inspection: mil-prf-38534 (requires 8 pc . sample ? 5 pc. life, 3 pc. rga) g. internal water-vapor content (rga) samples and t est performance h. mtbf reliability calculations i. worst case/derating analysis j. deliverable process identification documentation (pid) k. customer source inspection (pre-cap / final) 5.3 test conditions. unless otherwise stated herein, i nspections are performed in accordance with those specified in mil-prf-55310 and mil-prf-38534, in that order. process travelers identify the applicable methods, conditions and pro cedures to be used. examples of electrical test procedures that correspond to mil-prf-55310 re quirements are shown in table 3. 5.4 special tests and descriptions. 5.4.1 frequency-temperature slew. frequency-temperature slew test has been developed as an indicator of higher than normal internal water vapo r content. the incremental temperature sweep from +125c to -55c and back to +125c recor ds output frequency fluctuations emulating the mass loading of moisture deposited on the crystal blank surface. though not replacing a customer?s internal water-vapor content (rga) requirement, confidence is increased without destructively testing otherwise g ood devices. 5.4.2 burn-in delta frequency aging (in option d). the f requency measurement for burn-in delta measurements is performed at the crystal?s upper tu rning point temperature where its effects on repeatable frequency accuracy are maximized. depen dent on the crystal specified, this temperature is typically between +65c and +85c, 0.2c. 5.5 deliverable data. the manufacturer supplies the fo llowing data, as a minimum, with each lot of devices: a. completed assembly and screening lot travelers, including rework history. b. electrical test variables data, identified by un ique serial number. c. frequency-temperature slew plots, radiographic f ilms, group c data and rga data as required by purchase order.
size code ident no. unspecified tolerances dwg no. rev. sheet a 00136 n/a os-68338 k 8 5.6 discrepant material. all mrb authority resides wit h the procuring activity. 5.7 failure analysis. any catastrophic failure (no clo cking, no current) at post burn-in or after will be evaluated for root cause. the customer wil l be notified after occurrence and upon completion of the evaluation. 6. preparation for delivery 6.1 packaging. devices will be packaged in a manner th at prevents handling and transit damage during shipping. devices will be handled in accord ance with mil-std-1686 for class 1 devices. 7. ordering information 7.1 ordering part number. the ordering part number is made up of an alphanumeric series of 15 characters. design-affected product options, identified by the parenthetic letter on the optional parameters list (? 5.2a and b), are in cluded within the device part number. the part number breakdown is described as: 1104 r 10m00000 a f model # (table 1) screening option per table 5, 5.1.1 design pedigree e = enhanced element evaluation, 100krad class s die, swept quartz r = 100krad class s die, swept quartz v = 100krad class s die, cultured quartz x = class s die, cultured quartz b = class b die, swept quartz c = class b die, cultured quartz d = ruggedized cots: cultured quartz, commercial grade compone nts input voltage a= 5.0v b= 3.3v frequency
size code ident no. unspecified tolerances dwg no. rev. sheet a 00136 n/a os-68338 k 9 7.1.1 model number. the device model number is the four (4) digit number assigned to a corresponding package and output combination per ta ble 1. 7.1.2 design pedigree. class s variants correspond to ei ther letter ?e?, ?r?, ?v? or ?x? and are described in paragraph 5.2a. class b variants corr espond to either letter ?b? or ?c? and are described in paragraph 5.2a. ruggedized cots, usin g commercial grade components, corresponds to letter ?d?. 7.1.2.1 input voltage. voltage is the 14 th character, letters ?a? representing 5.0v and ?b? f or 3.3v. 7.1.3 output frequency. the nominal output frequency is expressed in the format as specified in mil-prf-55310 utilizing eight (8) characters. 7.1.4 screening options. the 15 th character is the screening option (letter a thru g or x) selected from table 4. 7.2 optional design, test and data parameters. test an d documentation requirements above that of the standard high reliability model shall be spe cified by separate purchase order line items (as listed in ? 5.2c thru k).
size code ident no. unspecified tolerances dwg no. rev. sheet a 00136 n/a os-68338 k 10 1 /. all unassigned pins have no internal connection s or ties. 2 /. see appendix a table 1 - item identification and package outline pin i/o 1 / hi-rel standard model # package output , square wave vcc out gnd/ case e/d mechanical outline 1101 12 lead flatpack acmos 12 7 6 na figure 1 1102 14 lead flatpack acmos 14 8 7 na figure 2 1103 16 lead flatpack acmos 8 10 9 na figure 3 1104 20 lead flatpack acmos 13, 20 11 10 na figure 6 1105 14 pin dip acmos 14 8 7 na figure 7 1106 20 lead ceramic acmos 4 39 37 na figure 4 1113 40 pad lcc acmos 4 39 37 na figure 4 1115 4 pin ? dip acmos 8 5 4 na figure 5 1116 j-lead smt acmos 4 3 2 1 figure 8 1118 2 /. 4 pad 5 x 7mm acmos 4 3 2 1 figure 9 1107 12 lead flatpack ttl 12 7 6 na figure 1 1108 14 lead flatpack ttl 14 8 7 na figure 2 1109 16 lead flatpack ttl 8 10 9 na figure 3 1110 20 lead flatpack ttl 13, 20 11 10 na figure 6 1111 14 pin dip ttl 14 8 7 na figure 7 1112 20 lead ceramic ttl 4 39 37 na figure 4 1114 40 pad lcc ttl 4 39 37 na figure 4 1117 j-lead smt ttl 4 3 2 1 figure 8
size code ident no. unspecified tolerances dwg no. rev. sheet a 00136 n/a os-68338 k 11 1 /. exception: frequency range @ 5v operation for mo del 1117 (ttl) series is limited to 85 mhz. 2 /. waveform measurement points and logic limits are in accordance with mil-prf-55310. table 2 - electrical performance characteristics operation listing requirements and conditions vectron test procedure @ all electrical tests input current (no load) mil-prf-55310, para 4.8.5.1 gr-51681 initial accuracy @ ref. temp. mil-prf-55310, para 4 .8.6 gr-51596 output logic voltage levels mil-prf-55310, para 4.8 .21.3 gr-51597 rise and fall times mil-prf-55310, para 4.8.22 gr-5 1599 duty cycle mil-prf-55310, para 4.8.23 gr-51601 @ post burn-in electrical only overvoltage survivability mil-prf-55310, para 4.8.4 gr-37269 initial freq. ? temp. accuracy mil-prf-55310, para 4.8.10.1 gr-51602 freq. ? voltage tolerance mil-prf-55310, para 4.8.1 4 gr-51602 start-up time (fast/slow start) mil-prf-55310, para 4.8.29 gr-61352 table 3 - electrical test parameters frequency range @ 5v operation: 0.35 mhz to 100.0 m hz 1 /. frequency range @ 3.3v operation: 0.35 mhz to 100.0 mhz temperature range: -55c to +125c frequency tolerance, initial accuracy @ +23c: 15 ppm max. frequency-temperature stability from +23c ref.: 50 ppm max. frequency-voltage tolerance: 4 ppm max. (vcc 10% ) frequency aging: 1 ppm max. 1 st 30 days, 5 ppm max. year 1, 2 ppm max. year 2+ start-up time: 10.0 ms max. frequency range (mhz) current (ma) (max. no load) 5.5v | 3.63v rise / fall times (ns max.) duty cycle (%) fan-out (if ttl) 0.35 - 4.0 10 6 6 45 to 55 10 4.0 ? 12.0 15 8 5 45 to 55 10 >12.0 ? 24.0 15 10 5 40 to 60 10 >24.0 ? 40.0 20 15 5 40 to 60 6 >40.0 ? 65.0 35 20 5 40 to 60 6 >65.0 ? 85.0 45 25 3 40 to 60 6 >85.0 ? 100 55 30 3 40 to 60 6
size code ident no. unspecified tolerances dwg no. rev. sheet a 00136 n/a os-68338 k 12 model # thermal resistance junction to case jc (c / w) ? junction temp. t j (c @ max. icc) 1101 / 1107 17.32 5.24 1102 / 1108 17.32 5.24 1103 / 1109 17.20 5.20 1104 / 1110 16.97 5.13 1105 / 1111 19.57 5.92 1106 / 1112 4.38 1.33 1113 / 1114 4.38 1.33 1115 20.22 6.12 1116 / 1117 17.91 5.42 1118 3.77 1.14 maximum operating power = 302.5 mw per table 2. table 4 - thermal characteristics
size code ident no. unspecified tolerances dwg no. rev. sheet a 00136 n/a os-68338 k 13 legend: x = required, nr = not required, ar = as r equired table 5 - test matrix 3 / includes frequency recorded at the crystal upper turning point (utp) temperature. 4 / f @ utp = 7.5 ppm maximum. 5 / f @ utp = 2.5 ppm maximum. 6 / performed at package lat. include lat data shee t 7 / when specified, rga samples will be removed from the lot after completion of this operation. use o f screening failures require customer concurrence. 8 / by customer request, the aging test may be termin ated after 15 days if the measured aging rate is le ss than one-half the specified aging rate, as descr ibed in paragraph 4.3.4.1 herein. see the customer po. 9 /. pda is not applicable. opn. no. operation listing requirements and conditions optio n a option b option c option d option e option f option g option x screening mil class similarity k 100% b- 100% s- 100% k+ 100% b 100% s 100% 100% em 100% 1 non-destruct bond pull mil-std-883, meth 2023 2 internal visual mil-std-883, meth 2017 class k, meth 2032 class k completed during assembly 3 stabilization (vacuum) bake mil-std-883, meth 100 8, cond c, 150c, 48 hours min. 4 thermal shock mil-std-883, meth 1011, cond a nr nr x nr nr x nr nr 5 temperature cycle mil-std-883, meth 1010, cond. b , 10 cycles min. x x x x x x x nr 6 constant acceleration mil-std-883, meth 2001, con d a, y1 plane only, 5000 g?s x x x x x x x nr 7 particle impact noise detection mil-std-883, meth 2020, cond b x x x x x x nr x 8 electrical testing, pre burn-in perform tests in table 3. nominal vcc, nominal temperature x x x x, 3 / x x x x 9 freq-temp slew test operating temp. range, frequency plotted at 1.0c steps ar ar ar ar ar ar nr nr 10 1 st burn-in mil-std-883, meth 1015, condition b x 160 hrs. x 160 hrs. x 240 hrs. x 160 hrs. x 160 hrs. x 240 hrs. x 160 hrs. nr 11 electrical testing, intermediate perform tests in table 3. nominal vcc, nominal temperature x nr nr x, 4 / nr nr nr nr 12 2 nd burn-in mil-std-883, meth 1015, condition b x 160 hrs. nr nr x 160 hrs. nr nr nr nr 13 electrical testing, post burn-in (group a) perform tests in table 3. nominal vcc & extremes, nominal temperature & extremes x x x x, 5 / x x x nom. vcc nr 14 seal: fine leak mil-std-883, meth 1014, cond a2 5 x 10 -8 atm cc/sec max x x x x x x x x 15 seal: gross leak mil-std-202, meth 112, cond d x x x x x x x x 16 radiographic inspection mil-std-883, meth 2012 x ar ar x ar x nr nr 17 solderability mil-std-883, meth 2003 6 / 6 / 6 / 6 / 6 / 6 / 6 / nr 18 external visual & mechanical mil-std-883, me th 2009 x 7 / x 7 / x 7 / x 7 / x 7 / x 7 / x 7 / x 7 / 19 aging, 30 day 8 / (m55310 group b) mil-prf-55310, para. 4.8.35.1 nr nr nr nr 13 pcs. x 9 /. nr nr
size code ident no. unspecified tolerances dwg no. rev. sheet a 00136 n/a os-68338 k 14 subgroup class test mil-std-883 quantity mil-prf- 38534 reference k method condition (accept number) paragraph 1 x element electrical a. may perform at wafer level b. all failures shall be removed from the lot c. perform at room ambient 100% c.3.3.1 2 x element visual 2010 100% c.3.3.2 3 x internal visual 2010 10(0) or 22(0) c.3.3.3 c.3.3.4.2 4 x temperature cycling 1010 c c.3.3.3 x mechanical shock or constant acceleration 2002 2001 b, y1 direction 3,000 g, y1 direction 10(0) 22(0) x interim electrical c.3.3.4.3 x burn-in 1015 240 hours minimum at +125c x post burn-in electrical c.3.3.4.3 x steady state life 1005 x final electrical c.3.3.4.3 5 x wire bond evaluation 2011 10(0) wires or 20(1) wires c.3.3.3 c.3.3.5 6 x sem 2018 see method 2018 c.3.3.6 notes: subgroups 3, 4, & 5 shall be performed on a sample of 10 die if the wafer lot is from a qpl/qml line. if the die are from commercial wafer lots, then the sample size sh all be 22 die. table 6 - microcircuit enhanced element evaluation parts type test requirement paragraph sample size allowable reject(s) ceramic capacitors m55681 frl s or m123 (chips) n/a n/a n/a n/a resistors m55342 frl r or s n/a n/a n/a n/a inductors group a mil-std-981 mil-std-981 mil-std-981 custom group b mil-std-981 mil-std-981 mil-std-981 table 7: passive component enhanced element evaluat ion
size code ident no. unspecified tolerances dwg no. rev. sheet a 00136 n/a os-68338 k 15 figure 1 models 1101 & 1107 package outline figure 2 models 1102 & 1108 package outline tolerances: unspecified = 0.010?
size code ident no. unspecified tolerances dwg no. rev. sheet a 00136 n/a os-68338 k 16 figure 3 models 1103 & 1109 package outline figure 4 models 1106 & 1112 package outline models 1113 & 1114 - same package minus the leads
size code ident no. unspecified tolerances dwg no. rev. sheet a 00136 n/a os-68338 k 17 figure 5 model 1115 package outline figure 6 model 1104 & 1110 package outline
size code ident no. unspecified tolerances dwg no. rev. sheet a 00136 n/a os-68338 k 18 figure 7 model 1105 & 1111 package outline figure 8 model 1116 & 1117 package outline
size code ident no. unspecified tolerances dwg no. rev. sheet a 00136 n/a os-68338 k 19 appendix a 4 pad 5 x 7mm acmos hybrid, model number 1118 serie s a.1 scope. the model 1118 series uses a fundamenta lly different design approach versus the other models offered by the os-68338 specificat ion. some of that text does not fit this design, so for that reason the model 1118 seri es is specified here in appendix a. where not superseded by this appendix the original text still applies. a.2 design. the model 1118 series uses an at-strip crystal mounted at two adjacent points. due to the crystal?s smaller mass this 2-p oint design has proven its ruggedness by passing the same environmental qualification exp osures of the other os-68338 models (? 3.4.1.2). frequency range operation: 0.7 mhz to 54 mhz temperature range: -55c to +125c frequency tolerance, initial accuracy @ +23c: 15 ppm max. frequency-temperature stability from +23c ref.: 75 ppm max. frequency-voltage tolerance: 4 ppm max. (vcc 10% ) frequency aging: 1 ppm 1 st 30 days, 5 ppm max. year 1, 2 ppm max. year 2+ start-up time: 10.0 ms max. frequency range (mhz) current (ma) (max. no load) 5.5v | 3.63v rise / fall times (ns max.) duty cycle (%) 0.7 - 4.0 10 6 6 45 to 55 4.0 ? 12.0 15 8 5 45 to 55 >12.0 ? 24.0 15 10 5 45 to 55 >24.0 ? 40.0 20 15 5 40 to 60 >40.0 ? 54.0 35 20 5 40 to 60 2 /. waveform measurement points and logic limits ar e in accordance with mil-prf-55310. table 2a - electrical performance characteristics, model 1118 series a.3 marking. device marking, due to size, will be limited to the vectron logo (vi), date code, pin 1 / esd id and the fully traceable work o rder ? unique serial number combination, i.e. 370002-20. individual device pac kaging will include the full part number.
size code ident no. unspecified tolerances dwg no. rev. sheet a 00136 n/a os-68338 k 20 figure 9 model 1118 package outline
size code ident no. unspecified tolerances dwg no. rev. sheet a 00136 n/a os-68338 k 21 document change record revision change f eco 04-2126 add application overview: ? 1.2 add new para. for ruggedized cots: ? 3.4.7 add design pedigree ?d?: ? 5.2, 7.1 add references to ruggedized cots: ? 3.1, 7.1.2 add screening option ?g?: ? 5.1.1, 7.1.4 table 1: change all hcmos or acmos, replace mil package references with applicable adde d figures table 4: add screening options ?g? and ?em? add figures 6 thru 8 g eco 05-0727 add ? 3.4.1.2 environmental integrity ? 4.1.3: add seu / sel statement ? 4.3.1: change 3.3vdc tolerance from 5% to 10% ? 4.3.4: revised aging from 5 ppm / year max. to 5 ppm max. year 1, 2 ppm max. year 2+ ? 5.2: add (v) hi-rel design w/ 100krad class s die , cultured quartz ? 7.1 design pedigree: add v=100krad class s die, c ultured quartz table 1: add 1118 model number info table 2, current column: split into 5.5v and 3.6v c olumns and revised limits downward table 2, rise/fall times column: revise limits dow nward for 12 mhz and >65.0 to 80 mhz ranges add new table 4 thermal characteristics, renumber t est matrix to table 5 table 5 test matrix, option x column: correct opn. no. 5, 6 and 17 from ?x? to ?n/r? add appendix a for 5 x 7 requirements h eco 06-2510 ? 2.1: add vl-65339 add ? 3.3e, output source/sink current add ? 3.4.2g, ?getter? materials add ? 4.3.4.1 frequency aging duration option ? 5.1.1: s/o ?g?, clarify description ? 5.2e & 5.2f: clarify group c sample sizes table 1: 1106 & 1112 package name to 20 lead cerami c table 2: add frequency ranges of both voltages; >65 .0mhz ? 85.0; >85.0 -100, ?n/a? under 3.63v column table 5: add note 8 figure 2: add unspecified tolerance dimension i eco 07-0692 ? table 5: corrected operation 2 reference to ?cond. k?. ? table 5: changed table 5 opn 10 and 12 to note meth od 1015 condition b. ? added new sentence to end of par 5.1 describing th at post bi and group a are combined into one electrical test. ? added ?n/a? to table 2 for the 85.00-100.00 ?fan-ou t? column. ? removed photo from cover page (to reduce file size) .
size code ident no. unspecified tolerances dwg no. rev. sheet a 00136 n/a os-68338 k 22 j eco 08-0145 paragraph 4.1.5: added "class s" & "swept quartz" table 2: replaced "n/a" with "30", at row ?85.00-10 0.00?, column ?3.63 v? figure 3: changed ".057" to ".042", the dimension a t back-to-leads k co-14428 sheet1: inserted picture on cover sheet. ? 4.1.2: added ?minimum? and ?lot evaluations are in accorda nce with mil-prf-55310 or enhanced element evaluation as specified in table 7.? ? 4.1.3: added ?and for enhanced element evaluation as speci fied in table 6.? added: ? vectron has conducted additional see testing in 200 8 to verify this performance since our lot wafer testing does not include these parameters and determinations.? ? 4.1.6: added new paragraph. ? 4.3.4: added ?when screening option f is selected, aging i s? compliance to the aging limit.? ? 5.1.1: added ?modified? to options f and g. ? 5.2, 7.1 and 7.1.2: added option (e) for enhanced element evaluation table 1: added footnote 2 for model 1118 table 2: added footnote 1 changed frequency range maximum @ 3.3v operation fr om ?85.0 mhz? to ?100.0 mhz? table 5: added footnote 9 for option f. ?pda is not applicab le? tables 6 and 7: new figures 3, 6 and 9: redrawn ? a.3: deleted. renumbered paragraphs. table 2a: added ?frequency range: 0.7 mhz to 54 mhz? changed duty cycle at >12.0-24.0 from ?40 to 60? to ?45 to 55?

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